United States Publication 20080174003


Apparatus and method for reduced delamination of an integrated circuit module

Published:  July 24, 2008

Inventors:  Monthei; Dean L.; (Beaverton, OR) ; Espinoza; Antonio; (Lake Oswego, OR) ; Holgado; Waldemar J.; (Hillsboro, OR)

Abstract: An apparatus and method for reducing delamination of an integrated circuit module is disclosed. The integrated circuit module includes a laminate substrate. The integrated circuit module further includes an integrated circuit die operably coupled with the laminate substrate and a plastic semiconductor package overmolded with the laminate substrate. The laminate substrate includes a die attach pad including a plurality of metal oxide regions and non-oxidized metal regions disposed on the die attach pads.